JEONG MO HWANG

Corporate Board Profile

Tech Score: 0/100

AMTECH SYSTEMS INC

Filing Date	Source Excerpt
2010-01-29	Jeong Mo Hwang has been a director since June 25,2009. The Compensation and Stock Option Committee – Jeong Mo Hwang. The Nominating and Governance Committee – Jeong Mo Hwang.
2010-12-21	Jeong Mo Hwang, Ph.D. has been a director since June 2009. Dr. Hwang most recently served as Director of Process Engineering in charge of magnetic memory process technology development for Magsil Corp. from 2009 to 2010. He received a Ph.D. in electrical engineering from Arizona State University where his graduate research related to modeling high-level light illumination effects on solar cell efficiency. He has over 20 years of solar and semiconductor technology experience. From 2008 to 2009, Dr. Hwang was a senior manager in charge of NOR flash periphery device development for Spansion Inc. He was Director of Process Engineering for Simtek Corp. from 2005 to 2008, managing the development of non-volatile SRAM products. From 2000 to 2004, he was VP of Research and Development for Dongbu-Anam Semiconductor Inc. and led the development teams for standard CMOS logic processes as well as other specialty technologies. Prior to 2000, Dr. Hwang held engineering, and technology leadership positions with leading semiconductor companies, LG Semicon Co., Texas Instruments and Westinghouse. Dr. Hwang also has a Masters of Science degree in Electrical Engineering from Korea Advanced Institute of Science and Technology and a Bachelors degree in Electronics Engineering from Pusan National University in Korea. Dr. Hwang’s engineering expertise allows him to provide the Board of Directors with insight in to the technological aspects of the Company’s business, including research and development. Compensation and Stock Option Committee members include Jeong Mo Hwang. Nominating and Governance Committee members include Jeong Mo Hwang. Technology Strategy Committee members include Jeong Mo Hwang. Director compensation table shows total compensation of $80,590.

Filing Date

Source Excerpt

2010-01-29

Jeong Mo Hwang has been a director since June 25,2009. The Compensation and Stock Option Committee – Jeong Mo Hwang. The Nominating and Governance Committee – Jeong Mo Hwang.

2010-12-21

Jeong Mo Hwang, Ph.D. has been a director since June 2009. Dr. Hwang most recently served as Director of Process Engineering in charge of magnetic memory process technology development for Magsil Corp. from 2009 to 2010. He received a Ph.D. in electrical engineering from Arizona State University where his graduate research related to modeling high-level light illumination effects on solar cell efficiency. He has over 20 years of solar and semiconductor technology experience. From 2008 to 2009, Dr. Hwang was a senior manager in charge of NOR flash periphery device development for Spansion Inc. He was Director of Process Engineering for Simtek Corp. from 2005 to 2008, managing the development of non-volatile SRAM products. From 2000 to 2004, he was VP of Research and Development for Dongbu-Anam Semiconductor Inc. and led the development teams for standard CMOS logic processes as well as other specialty technologies. Prior to 2000, Dr. Hwang held engineering, and technology leadership positions with leading semiconductor companies, LG Semicon Co., Texas Instruments and Westinghouse. Dr. Hwang also has a Masters of Science degree in Electrical Engineering from Korea Advanced Institute of Science and Technology and a Bachelors degree in Electronics Engineering from Pusan National University in Korea. Dr. Hwang’s engineering expertise allows him to provide the Board of Directors with insight in to the technological aspects of the Company’s business, including research and development. Compensation and Stock Option Committee members include Jeong Mo Hwang. Nominating and Governance Committee members include Jeong Mo Hwang. Technology Strategy Committee members include Jeong Mo Hwang. Director compensation table shows total compensation of $80,590.

Data sourced from SEC filings. Last updated: 2025-08-30