Corporate Board Profile
Tech Score: 60/100
3 mention(s) identify ARMANDO GEDAY as having software/technology expertise.
| Company | Filing Date | Evidence | Reason |
|---|---|---|---|
| COMMVAULT SYSTEMS INC | 2015-07-08 | Mr. Geday obtained his bachelor’s degree in electrical engineering from the Florida Institute of Technology. | Mr. Geday has an electrical engineering degree and experience in semiconductor and technology companies, indicating technical skills relevant to software. |
| COMMVAULT SYSTEMS INC | 2016-07-01 | Mr. Geday obtained his bachelor’s degree in electrical engineering from the Florida Institute of Technology. Mr. Geday served as president, chief executive officer and a director of GlobespanVirata, Inc., a digital subscriber line chipset design company. | Holds a bachelor’s degree in electrical engineering and has held technical and executive roles in semiconductor and technology companies. |
| COMMVAULT SYSTEMS INC | 2017-07-05 | Mr. Geday obtained his bachelor’s degree in electrical engineering from the Florida Institute of Technology. | Has a bachelor’s degree in electrical engineering and experience as CEO of technology companies involved in semiconductor and communications technology. |
| Filing Date | Source Excerpt |
|---|---|
| 2014-07-03 | Mr. Geday obtained his bachelor’s degree in electrical engineering from the Florida Institute of Technology. |
| 2015-07-08 | Mr. Geday obtained his bachelor’s degree in electrical engineering from the Florida Institute of Technology. |
| 2016-07-01 | Mr. Geday obtained his bachelor’s degree in electrical engineering from the Florida Institute of Technology. Mr. Geday served as president, chief executive officer and a director of GlobespanVirata, Inc., a digital subscriber line chipset design company. |
| 2017-07-05 | Mr. Geday obtained his bachelor’s degree in electrical engineering from the Florida Institute of Technology. |
| 2018-07-03 | Mr. Geday obtained his bachelor’s degree in electrical engineering from the Florida Institute of Technology. |
Data sourced from SEC filings. Last updated: 2026-02-03