Corporate Board Profile
Tech Score: 100/100
2 mention(s) identify TING HERH as having software/technology expertise.
| Company | Filing Date | Evidence | Reason |
|---|---|---|---|
| TD SYNNEX CORP | 2024-02-05 | Mr. Herh received his BS from National Chiao Tung University, Taiwan in 1977 and MS Electrical Engineering and Computer Science from the University of California, Berkeley in 1980... Mr. Herh has been in the IT industry especially in the telecom/datacom and semiconductor field for over 43 years. | He has a Master of Science in Electrical Engineering and Computer Science and extensive experience in engineering and technology companies. |
| TD SYNNEX CORP | 2025-02-20 | Mr. Herh received his Bachelor of Science degree from National Chiao Tung University, Taiwan in 1977 and Master of Science degree in Electrical Engineering and Computer Science from the University of California, Berkeley in 1980, and DBA degree from Victoria University, Switzerland in 2005. He has been in the IT industry especially in the telecom/datacom and semiconductor field for over 44 years. | Mr. Herh has a Master of Science degree in Electrical Engineering and Computer Science and extensive experience in telecom/datacom and semiconductor engineering roles. |
| Filing Date | Source Excerpt |
|---|---|
| 2024-02-05 | Mr. Herh received his BS from National Chiao Tung University, Taiwan in 1977 and MS Electrical Engineering and Computer Science from the University of California, Berkeley in 1980... Mr. Herh has been in the IT industry especially in the telecom/datacom and semiconductor field for over 43 years. |
| 2025-02-20 | Mr. Herh received his Bachelor of Science degree from National Chiao Tung University, Taiwan in 1977 and Master of Science degree in Electrical Engineering and Computer Science from the University of California, Berkeley in 1980, and DBA degree from Victoria University, Switzerland in 2005. He has been in the IT industry especially in the telecom/datacom and semiconductor field for over 44 years. |
Data sourced from SEC filings. Last updated: 2026-02-03